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High bonding strength especially suitable for the applications where cure speed needs to be accelerated.
It is particularly suited to bonding difficult substrates which have a porous or uneven nature since it increases bonding strength by preventing the adhesive to be absorbed by the surface.
It is suitable for the bonding of a very wide range of materials, including acidic surfaces and some porous ones, where rapid bonding times are required.
Overall quality is good & delivered on time
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